Applications include bonding and securing data cable materials, speaker structure bonding, reinforcing motherboard components, sealing display screens, bonding of casing components, keyboard bonding, and thermal management system heat conduction.
Thermal Conductive Pad
Thermal Conductive Gel
Phone: +86 023-46237882
Fax: +86 0512-65915306
E-mail: csr@somid.cn
Manufacturing Facility: Building 20, Nacheng Industry Smart Valley, No. 8 Chuangxin Avenue, Changzhou Street, Rongchang District, Chongqing City