

Applications include bonding and securing data cable wires, bonding speaker structures, camera module bonding, fingerprint module bonding, reinforcing motherboard components, sealing and bonding display screens, bonding enclosure parts, waterproof sealing of connectors, and thermal management system heat conduction, among others.
UV Adhesive
One Component Epoxy Adhesive
PUR Adhesive
Modified Silane Structural Adhesive
Thermal Conductive Pad
Phone: +86 023-46237882
E-mail: csr@somid.cn
Manufacturing Facility: Building 20,No. 8 Chuangxin Avenue, Changzhou Street, Rongchang District, Chongqing City
