One Component Epoxy Adhesive
Features:
Temperature Flexibility: Can cure at super low temperatures of 60-80°C or high temperatures of 100-150°C within 1-5 minutes.
Strong Bonding: Exhibits strong adhesive properties for various plastics, metals, and glass materials.
Low Volatility: Suitable for applications in the chip and optical industries with low VOC content.
Excellent Weather Resistance: Meets the weathering requirements of extreme environments.
Applications:
CMOS Module: Die fixation, holder fixation, lens fixation, AA assembly, FPC reinforcement.
BGA Filling: Reinforcement for SMT components and BGA filling.
Chip Packaging: Optical chip packaging for scanner chips, laser printer chips, and similar applications.
Thermal Bonding: Bonding for high-power product thermal structures.
SMT Soldering: Bonding for surface mount technology (SMT) components, wave soldering reinforcement.
Fingerprint Recognition Bonding: Reinforcement for cover plates, components, and structural bonding.
|
Product Model |
Viscosity (mPa.s) @25℃ |
Hardness |
Color |
Curing Conditions |
Typical Applications |
|
4505 |
6000-16000 |
68D |
Red |
4min/130℃ |
Camera, Fingerprint Lock, Acoustic Products |
|
4218 |
10000-20000 |
80D |
Black |
10-30min/80℃ |
High-Temperature, High Strength, Structural Bonding |
|
4215 |
15000-30000 |
75D |
Black |
10-20min/80℃ |
Camera, Fingerprint Lock, Acoustic Products |
|
4216 |
20000-40000 |
78D |
Black |
10-20min/80℃ |
Camera, Fingerprint Lock, Acoustic Products |
|
4518 |
5000-10000 |
65D |
black |
10-20min/130℃ |
Used for Reinforcing Flexible PCB Components |
|
4519 |
100-500 |
72D |
Transparent/black |
10-20min/130℃ |
BGA, Component Reinforcement |
|
4520 |
1000-2000 |
75D |
Transparent/black |
10-20min/130℃ |
BGA, Component Reinforcement |
|
4589 |
300-600 |
75D |
Transparent/black |
10-20min/120℃ |
BGA, Component Reinforcement |
|
4580 |
25000-35000 |
78D |
White/black |
5-10min/80℃ |
Rapid Curing, Structural Bonding |
|
4609 |
70000-150000 |
75D |
Red |
1-3min/150℃ |
SMT Surface Mount Adhesive |
|
4611 |
200000-300000 |
80D |
Red |
1-3min/150℃ |
SMT Surface Mount Adhesive |
|
Product Model |
Viscosity (mPa.s) @25℃ |
Hardness |
Color |
Curing Conditions |
Typical Applications |
|
4505 |
6000-16000 |
68D |
Red |
4min/130℃ |
Camera, Fingerprint Lock, Acoustic Products |
|
4218 |
10000-20000 |
80D |
Black |
10-30min/80℃ |
High-Temperature, High-Strength, Structural Bonding |
|
4215 |
15000-30000 |
75D |
Black |
10-20min/80℃ |
Camera, Fingerprint Lock, Acoustic Products |
|
4216 |
20000-40000 |
78D |
Black |
10-20min/80℃ |
Camera, Fingerprint Lock, Acoustic Products |
|
4518 |
5000-10000 |
65D |
black |
10-20min/130℃ |
Used for Reinforcing Flexible PCB Components |
|
4519 |
100-500 |
72D |
Transparent/black |
10-20min/130℃ |
BGA, Component Reinforcement |
|
4520 |
1000-2000 |
75D |
Transparent/black |
10-20min/130℃ |
BGA, Component Reinforcement |
|
4589 |
300-600 |
75D |
Transparent/black |
10-20min/120℃ |
BGA, Component Reinforcement |
|
4580 |
25000-35000 |
78D |
White/black |
5-10min/80℃ |
Rapid Curing, Structural Bonding |
|
4609 |
70000-150000 |
75D |
Red |
1-3min/150℃ |
SMT Surface Mount Adhesive |
|
4611 |
200000-300000 |
80D |
Red |
1-3min/150℃ |
SMT Surface Mount Adhesive |
Phone: +86 023-46237882
Fax： +86 0512-65915306
E-mail: csr@somid.cn
Manufacturing Facility: Building 20, Nacheng Industry Smart Valley, No. 8 Chuangxin Avenue, Changzhou Street, Rongchang District, Chongqing City
渝公网安备 50022602000456号