Main Types of Electronic Adhesives

There are various types of electronic adhesives, including EVA hot melt adhesive, organosilicone adhesive, epoxy adhesive, UV adhesive, PUR adhesive, conductive adhesive, instant adhesive, polyurethane-based adhesive, anaerobic adhesive, and more. Among them, silicone, EVA hot melt adhesive, and PUR adhesive have the highest production volumes, while other electronic adhesive products have relatively lower production quantities. These include various insulation materials, shielding materials, EMI materials, shockproof products, heat-resistant and insulating materials, adhesive products, dustproof materials, sponge products, and other special materials suitable for manufacturers in the electronics, electrical, toy, lighting, telecommunications, mechanical, and other industries.

1、SMT/SMD/SMC Electronic Adhesive

SMT/SMD/SMC Electronic Adhesive – Surface Mount Red Adhesive.

SMT red adhesive is a single-component epoxy resin adhesive that can be stored at room temperature and cures rapidly when heated. Even when applied in ultra-high-speed and minimal quantities, it maintains a stable shape without stringing, overflow, or collapse. It possesses the "shear-thinning" viscosity characteristic and low moisture absorption. Therefore, it is suitable for use with high-speed surface mount assembly machines (syringe type) for dispensing and is particularly well-suited for various ultra-high-speed dispensing machines, such as HDF machines.

    The purpose of the red adhesive is to securely bond the components to the PCB surface, forming the best adhesive strength between various materials in a very short time to prevent them from falling off. It has high storage stability and is suitable for memory cards, CCD/CMOS devices, and particularly ideal for heat-sensitive components that require low-temperature curing.

2、COB/COG/COF Electronic Adhesive

COB/COG/COF Electronic Adhesive - Encapsulating Filler.

COB bonding black adhesive, part of the encapsulating filler series, is a single-component epoxy adhesive designed for IC packaging on epoxy glass substrates, such as battery circuit protection boards and similar products. This product offers excellent solder resistance and moisture resistance, a low coefficient of thermal expansion to minimize deformation, outstanding temperature cycle performance, and superior flowability.

COB bonding black adhesive is a single-component epoxy resin adhesive, making it the ideal companion for IC bonding. It is specifically designed for soft encapsulation of IC electronic crystals and is suitable for various electronic products like calculators, PDAs, LCDs, instruments, and more. It is characterized by high flowability, easy dispensing with low dispensing heights. After curing, it exhibits properties such as flame resistance, bend resistance, low shrinkage, and low moisture absorption, providing effective protection for ICs. The design of this encapsulant is the result of extensive testing, testing and thermal cycling, making it a high-quality product.

3、 BGA/CSP/WLP Electronic Adhesive

BGA/CSP/WLP Electronic Adhesive - Underfill.

Underfill is a single-component epoxy sealing material used in the CSP and BGA underfilling process. It forms a consistent and defect-free underfill layer, effectively reducing the mismatch in thermal expansion characteristics between the silicon chip and the substrate or impacts caused by external forces. Its lower viscosity characteristics make it better for underfilling, and its higher flowability enhances its rework operability.

4、MC/CA/LE/EP Packaging Materials

MC/CA/LE/EP Packaging Materials - Conductive Silver Adhesive.

Conductive silver adhesive is a single-component epoxy conductive adhesive with silver powder as the medium. It features high purity, high conductivity, low modulus, and long working life. This type of product has excellent room-temperature storage stability, a lower curing temperature, low ion impurity content, and cured materials with good electrical and mechanical properties, as well as temperature and heat stability. The product has been successfully applied in various areas, including conductive bonding for LED, LCD, quartz resonators, tantalum chip capacitors, VFD, IC, and is suitable for printing or dispensing processes.

5、 Specialized Organic Silicon Electronic Packaging Materials

Specialized Organic Silicon Electronic Packaging Materials - Many assembly processes use organic silicon adhesives.The weather resistance and resistance to aging from UV and high temperatures make organic silicon adhesives widely applicable in industries such as solar energy, lighting equipment, and household appliances.